Panel Level Packaging Market - Forecast(2022 - 2027)
Panel Level Packaging Market Overview Panel Level Packaging Market Size is forecast to reach $3.5 billion by 2026, at a CAGR of 18.5% during 2021-2026. Panel Level packaging (PLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration, larger substrates formats also are targeted. In addition, manufacturers are increasingly driving their suppliers to provide panel -processing tools and materials to allow them to bring wafer-level precision to package processed on panel substrates. This packaging is used in the packaging of field programmable gate array (FPGA ), CPU/GPU, power management IC module, baseband, and others. Cost-effective packaging solution and flexible circuit designs are some of the major influencing factors for the growth of panel level packaging industry. Especially, the smaller form factor with enhanced thermal performance has generated huge demand for panel-level packaging technology among several ...