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Showing posts with the label Copper Wire Bonding ICs Market size

Copper Wire Bonding ICs Market - Forecast(2021 - 2026)

The ever increasing gold prices led to the transition of replacing gold with copper bond wires in semiconductor devices. Copper wire bonded ICs begin to be adopted in production consumer grade ICs in 2009 & 2010. Nowadays, copper wire bonded ICs have started being used in harsh environment applications, by replacing complex ICs, owing to process optimization. Globally, rising gold prices, growing global consumer electronics industry, and increasing adoption in automotive industry are the prime growth drivers of global copper wire bonding ICs market. In addition, growing consumer electronics and automotive industry in emerging economies such as China, India and others, will create new opportunities for global copper wire bonding ICs market . However, complex production process requiring improved designs and equipment, and lack of reliability for harsh environment applications and long life are the key restraints for global copper wire bonding ICs market. This report identifies the g...